In response to the growing demand for digital infrastructure, Hyper Photonix will present three major technology themes at COMNEXT: 400G/800G/1.6T silicon photonics modules, low-power LPO silicon photonics modules, and MCF (multi-core fiber) optical modules. These innovations are designed to address key challenges in data centers — “cost-saving”“power-saving” and “space-saving” — and are expected to become critical enablers for future AI clusters and data center architectures.
In response to the growing demand for digital infrastructure, Hyper Photonix will present three major technology themes at COMNEXT: 400G/800G/1.6T silicon photonics modules, low-power LPO silicon photonics modules, and MCF (multi-core fiber) optical modules. These innovations are designed to address key challenges in data centers — “cost-saving”“power-saving” and “space-saving” — and are expected to become critical enablers for future AI clusters and data center architectures.
Hyper Photonix is pleased to participate in the Ethernet Alliance demo at the ECOC 2024 conference in Frankfurt
