2026-06-10
Hyper Photonix Demonstrates World-First Multi-Vendor Interoperability for 1.6T MCF Optical Interconnects for AI Data Centers
2026-06-10
Interoperability with MCF (Multi Core Fiber) from Fujikura, Sumitomo Electric, and Corning marks a key step toward practical deployment
Tsukuba, Japan — [June 9, 2026] —Hyper Photonix, with its group company SiPhx Inc. headquartered in Tokyo Japan, announced today the successful demonstration of multi-vendor interoperability between its MCF-compatible optical transceiver and multicore fibers (MCFs) provided by three leading fiber manufacturers: Fujikura Ltd., Sumitomo Electric Industries, Ltd., and Corning Incorporated.
Through this demonstration, Hyper Photonix's MCF-compatible optical transceiver was validated as an MCF native interconnect transceiver compatible with MCFs from all three companies. The result marks an important milestone for MCF technology, showing that it has moved beyond the research and development stage and entered a practical implementation phase for AI data center deployment.
The evaluation also used MCF-dedicated test equipment from Anritsu Corporation, confirming a key foundation for a practical MCF ecosystem that includes fiber, optical transceivers, and measurement equipment.
Hyper Photonix’s group company SiPhx will showcases a live demonstration of the technology at Interop Tokyo 2026, taking place from Wednesday, June 10 to Friday, June 12, 2026, at Makuhari Messe (Hyper Photonix booth: Hall 3, 3Z07 Interop Pavilion).
Addressing Optical Cabling Challenges in AI Data Centers
As generative AI continues to scale, large AI data centers are facing rapidly growing bandwidth demand between GPU clusters. At the same time, the increasing number of optical fiber connections is creating major challenges around space, power consumption, and cable management.
Multicore fiber is emerging as a next-generation optical transmission technology that enables higher density and reduced cabling by integrating multiple transmission cores within a single optical fiber.
Evaluation Overview and Key Results
The evaluation was conducted using the following configuration:
• MCFs: 4-core MCFs from Fujikura, Sumitomo Electric, and Corning
• Optical transceiver: Hyper Photonix MCF-compatible optical transceiver
• Transmission speed: 1.6 Tbps
• Transmission distance: Up to 500 meters
Using Anritsu's dedicated MCF characterization equipment, Hyper Photonix evaluated inter-core characteristics and transmission quality. Stable high-speed signal transmission was confirmed across all combinations.
This technology is expected to deliver the following benefits:
• Up to 75% reduction in optical fiber usage
• Significant space savings for GPU cluster cabling
• Greater design flexibility through higher-density cabling
• Reduced infrastructure burden and improved scalability for AI data centers
The demonstration also shows the potential for open MCF deployment with an established ecosystem. Collaboration among multiple fiber manufacturers, optical transceiver vendors, and a measurement equipment provider represents an important step toward future standardization, quality evaluation, volume production, and market adoption.
Hyper Photonix will continue to advance MCF technology and next-generation high-speed interfaces, accelerating the deployment of scalable, energy-efficient optical interconnects for the next era of AI infrastructure.
Interop Tokyo 2026 Exhibition
Dates: Wednesday, June 10 – Friday, June 12, 2026
Venue: Makuhari Messe, Hall 3, 3Z07 Interop Pavilion
Exhibit: Live demonstration of MCF-compatible optical interconnect technology
About Hyper Photonix
Hyper Photonix is a leading provider of advanced optical networking solutions, dedicated to enabling high-speed, low-latency, and cost-effective connectivity for data centers, AI/ML infrastructure, and next-generation network architectures worldwide.
Contact:
Hyper Photonix
11900 NE 1st Street, Suite 300, Bellevue, WA 98005
In response to the growing demand for digital infrastructure, Hyper Photonix will present three major technology themes at COMNEXT: 400G/800G/1.6T silicon photonics modules, low-power LPO silicon photonics modules, and MCF (multi-core fiber) optical modules. These innovations are designed to address key challenges in data centers — “cost-saving”“power-saving” and “space-saving” — and are expected to become critical enablers for future AI clusters and data center architectures.
Live demonstration highlights breakthrough solution to the AI data center fiber scaling challenge
