Core Competencies in Hyper Photonix

Hyper Photonix’s Core Competencies 

Research and Development 

At Hyper Photonix, we've forged a vertical research paradigm spanning from silicon photonic chips to silicon photonic modules. Our comprehensive approach includes design platforms for pivotal components like AWG wavelength division multiplexer (WDM) chips, four-channel/eight-channel optical engines/modules, silicon photonic device chips, and DSP chips. Our prowess extends to core technologies supporting 800G-1.6T, employing cutting-edge three-dimensional modeling for devices, high-speed signal simulations for optical coupling and devices, and high-speed PCB layout designs. This robust foundation fuels our commitment to continuous product enhancement and evolution.

When it comes to manufacturing, Hyper Photonix boasts an advanced Chip-to-Transceiver production system. Starting with the optical chip design phase, the company leverages exclusive patents for its groundbreaking Hyper Silicon™ chip technology. It allows in-house development of Photonic Integrated Circuit (PIC) and Arrayed Waveguide Grating (AWG) chips with enhanced bandwidth and minimized loss. Moving to chip manufacturing, Hyper Photonix enjoys a long-time collaboration with a commercial Silicon Photonics (SiPh) wafer fab using Hyper Photonix own PDKs for customized SiPh wafer and backend chip processing.

In the realm of chip packaging and optical module production, Hyper Photonix boasts capabilities in automated coupling. Leveraging our proprietary optical component design and development, we achieve meticulous optical chip packaging. Subsequently, our state-of-the-art, cost-effective Chip-on-Board (COB) packaging lines ensure the efficient mass production of optical modules.

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